Lapha siphinda e-Shanghai, SEMICHINA 2019!
Ngihlose "I-Power & Compound Semiconductor International Forum 2019", okungomunye wemicimbi yochwepheshe emikhulu kakhulu mayelana namandla kanye nemboni ye-semiconductor ehlanganisiwe e-Asia, izohlelwa ngokuhlanganyela ne-SEMICON China 2019 ngo-Mar.21-22, 2019 e-Kerry Hotel e-Shanghai.
Iforamu iqukethe uhlelo lwezinsuku ezimbili futhi igxile ezihlokweni ezihlanganisa: I-Wide Band Gap Power Electronics, i-Optoelectronics, i-Compound Semiconductor in Communications, kanye ne-Emerging Power Device Technology.
Ngezinhlelo ze-SEMI, imiphakathi, imizamo, ucwaningo lwemakethe, kanye nokumela, i-SEMI yazisa futhi ixhumanise amalungu ayo kanye nemboni, ihlakulele ukubambisana, iqhubekisela phambili isenzo, futhi ivumelanise ukuqamba okusha ukuze kusheshiswe imiphumela yebhizinisi.Imiphakathi yesifunda nezobuchwepheshe ixhunywe kunkundla yokuncintisana yangaphambi kokusebenza ngokubambisana komhlaba wonke.
Isikhathi sokuthumela: 23-03-21