Imboni ye-chip izongeza izindwangu ezintsha ezingama-38 ezingama-300mm ngo-2024
Ukutshalwa kwe-300mm kwendwangu ngo-2020 kuzokhula ngo-13% unyaka nonyaka (YoY) ukuze kudlule irekhodi langaphambilini elibekwe ngo-2018 futhi kungene omunye unyaka wesibhengezo embonini ye-semiconductor ngo-2023, i-SEMI ibike namuhla ku-300mm Fab Outlook kuya ku-2024. Umqedazwe we-COVID-19 ubangele ukwanda kuka-2020 ekusetshenzisweni kwemali okuyindwangu ngokusheshisa izinguquko zedijithali emhlabeni wonke, futhi ukunyuka kulindeleke ukuthi kudlulele ku-2021.
Ukunika amandla ukukhula kwesidingo esikhulayo sezinsizakalo zamafu, amaseva, amakhompyutha aphathekayo, amageyimu nobuchwepheshe bokunakekelwa kwezempilo.Ubuchwepheshe obuvela ngokushesha obufana ne-5G, i-Inthanethi Yezinto (IoT), ezezimoto, ubuhlakani bokwenziwa (AI) nokufunda komshini okuqhubeka nokukhuthaza isidingo sokuxhumana okukhulu, izikhungo ezinkulu zedatha nedatha enkulu nakho kuyimbangela yokwanda.
"Ubhubhane lwe-COVID-19 lusheshisa uguquko lwedijithali oluthinta cishe yonke imboni ongayicabanga ukuze iguqule indlela esisebenza ngayo nesiphila ngayo," kusho u-Ajit Manocha, umongameli kanye ne-CEO ye-SEMI."Ukusetshenziswa kwerekhodi okucatshangelwayo kanye nezindwangu ezintsha ezingama-38 kuqinisa indima yama-semiconductors njengesisekelo sobuchwepheshe obuphambili obuqhuba lolu shintsho futhi sithembisa ukusiza ukuxazulula ezinye zezinselelo ezinkulu emhlabeni."
Ukukhula kokutshalwa kwezimali kwendwangu ye-semiconductor kuzoqhubeka ngo-2021 kodwa ngenani eliphansi le-4% YoY.Ngokubuka imijikelezo yezimboni yangaphambilini, umbiko uphinde ubikezele ukwehla kancane ngo-2022 kanye nokunye ukwehla okuncane ngo-2024 kulandela irekhodi eliphakeme lama- $ 70 billion ngo-2023.
Yengeza 38 Izindwangu Ezintsha ezingama-300mm
I-SEMI 300mm Fab Outlook kuya ku-2024 ikhombisa imboni yama-chip ingeza okungenani izindwangu ezintsha ezingama-38 zevolumu engu-300mm kusukela ngo-2020 kuya ku-2024, ukuqagela okuqinile okungabandakanyi emathubeni aphansi noma amaphrojekthi endwangu angamahemuhemu.Ngesikhathi esifanayo, umthamo wendwangu yenyanga uzokhula cishe ngama-wafers ayizigidi ezingu-1.8 ukuze ufinyelele ngaphezu kwezigidi ezingu-7.
Ngaphansi kwesibikezelo sephrojekthi esingenzeka kakhulu, imboni izongeza okungenani izindwangu zevolumu engu-300mm ezintsha ezingama-38 kusukela ngo-2019 kuya ku-2024. I-Taiwan izokwengeza izindwangu zevolumu eziyi-11 kanye ne-China eyisishiyagalombili ukubala ingxenye yayo yonke.Imboni yama-chip izolawula izindwangu zevolumu engu-161 300mm ngo-2024.
Ukukhula Kwezindleko Ngomkhakha Wemikhiqizo
Inkumbulo ibangela ingxenye enkulu yokwenyuka kokusetshenziswa kwendwangu engu-300mm.Ukutshalwa kwezimali kwangempela nokubikezelayo kubonisa ukukhuphuka okuqhubekayo kwedijithi eyodwa ephezulu unyaka ngamunye kusukela ngo-2020 kuya ku-2023, nokukhuphuka okunamandla ngo-10% okugciniwe ngo-2024.
Iminikelo ye-DRAM kanye ne-3D NAND ekusetshenzisweni kwendwangu engu-300mm ngeke ilingane kusukela ngo-2020 kuya ku-2024. Ukutshalwa kwezimali kwe-logic/MPU, nokho, kuzobona ukuthuthuka okuqhubekayo kusukela ngo-2021 kuya ku-2023. Amadivayisi ahlobene namandla azoba umkhakha ovelele ekutshalweni kwendwangu engu-300mm, nokungaphezu kwalokho. Ukukhula ngo-200% ngo-2021 kanye nokukhuphuka kwamadijithi amabili ngo-2022 nango-2023.
Ilandela ngomkhondo izindwangu nemigqa engu-286 ukusuka ku-2013 kuya ku-2024, i-300mm Fab Outlook kuya ku-2024 ibonisa izibuyekezo ezingu-247 ku-104 fab, izindwangu ezintsha eziyisishiyagalolunye kanye nohlu lwemigqa, kanye nokukhanselwa kabili kusukela kwashicilelwa umbiko ka-March 2020.
Isikhathi sokuthumela: 10-03-21